Asymmetrical wafer configurations and method for creating the same
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United States of America Patent
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Mar 5, 2013
Grant Date -
N/A
app pub date -
Jun 1, 2007
filing date -
Jun 1, 2007
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Expired
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Abstract
The present invention consists of a method for imparting asymmetry to a truncated annular wafer by either rounding one corner of the orientation flat, or rounding one corner of a notch. This novel method of rounding corners impart a visual and/or tactile asymmetry which can be utilized by a person in order to differentiate between the two different sides of the wafer. This inventive wafer design and method for making an asymmetric wafer is especially useful in the field of semiconductor technology and may be used on sapphire crystal wafers or any other class of wafer.
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