Material for forming electroless plate, coating solution for adhering catalyst, method for forming electroless plate, and plating method
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United States of America Patent
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Mar 5, 2013
Grant Date -
May 6, 2010
app pub date -
Feb 1, 2008
filing date -
Feb 7, 2007
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Abstract
A material for forming electroless plate comprising a non-conductive base material and a catalyst adhering layer provided on the non-conductive base material is constituted so that the catalyst adhering layer should comprise a hydrophilic (meth)acrylic resin constituted with a hydrophilic monomer and a hydrophobic monomer and containing the hydrophobic monomer at a ratio of 50 to 90 mol %. This material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of the catalyst adhering layer from the non-conductive base material, no dissolution of the catalyst adhering layer into a plating solution, and no discoloration of plate layer during the catalyst adhering step, development step and other steps.
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