Method for making a stressed structure designed to be dissociated
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United States of America Patent
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Mar 5, 2013
Grant Date -
Jul 1, 2010
app pub date -
Dec 1, 2009
filing date -
Dec 9, 2002
priority date (Note) -
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Abstract
A method of making a complex microelectronic structure by assembling two substrates through two respective linking surfaces, the structure being designed to be dissociated at a separation zone. Prior to assembly, in producing a state difference in the tangential stresses between the two surfaces to be assembled, the state difference is selected so as to produce in the assembled structure a predetermined stress state at the time of dissociation.
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