Semiconductor material manufacture

United States of America Patent

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Mar 5, 2013
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Aug 11, 2011
app pub date
Apr 18, 2011
filing date
Feb 4, 2009

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Abstract

Electronic apparatus, systems, and methods include a semiconductor layer bonded to a bulk region of a wafer or a substrate, in which the semiconductor layer can be bonded to the bulk region using electromagnetic radiation. Additional apparatus, systems, and methods are disclosed.

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Patent Owner(s)

Patent Owner	Address
U S BANK NATIONAL ASSOCIATION AS COLLATERAL AGENT	100 WALL STREET SUITE 1600 NEW YORK NY 10005

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Sandhu, Gurtej S	Boise, US	1223	33846
Sinha, Nishant	Boise, US	168	2187
Smythe, John	Boise, US	81	1673

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Semiconductor material manufacture

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United States of America Patent

13088863

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PATENT NO	8389385
APP PUB NO	20110193190A1
SERIAL NO	13088863
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 05, 2013	US,8389385,B2 US8389385B2	GRANTED PATENT AS SECOND PUBLICATION
August 11, 2011	US,20110193190,A1 US20110193190A1	FIRST PUBLISHED PATENT APPLICATION

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13088863

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