Rapid thermal processing by stamping
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United States of America Patent
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Mar 5, 2013
Grant Date -
Jun 2, 2011
app pub date -
Aug 31, 2007
filing date -
Aug 31, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A rapid thermal processing device and methods are provided for thermal processing of samples such as semiconductor wafers. The device has components including a stamp (35) having a stamping surface and a heater or cooler (40) to bring it to a selected processing temperature, a sample holder (20) for holding a sample (10) in position for intimate contact with the stamping surface; and positioning components (25) for moving the stamping surface and the stamp (35) in and away from intimate, substantially non-pressured contact. Methods for using and making such devices are also provided. These devices and methods allow inexpensive, efficient, easily controllable thermal processing.
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