Multilayered surrounding plate type heat dissipating structure
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United States of America Patent
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Mar 12, 2013
Grant Date -
Sep 23, 2010
app pub date -
Mar 16, 2010
filing date -
Mar 17, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A multilayer surrounding plate type heat dissipating structure comprises: a heat dissipating base module; a heat conducting insert, with an end coupled to the heat dissipating base module, and another end having a distal head portion; at least one light emitting element, installed at the distal head portion of the heat conducting insert; and a multilayer surrounding plate, installed to a ceiling, and having a through hole formed thereon, for passing the heat conducting insert, such that a heat source produced by the light emitting element can be dissipated through the multilayer surrounding plate or an airflow passage between multilayer surrounding plate to achieve an excellent heat dissipating effect, assure the functions of the light emitting element, and extend their lifespan.
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