Robust metal film encapsulation
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 12, 2013
Grant Date -
Oct 23, 2008
app pub date -
Apr 29, 2008
filing date -
Aug 9, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention relates to metal film encapsulation of an electrochemical device. The metal film encapsulation may provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure. The present invention may further include ways of providing heat and pressure resilience to the bonding layer and improving the robustness of the protection for the cell structure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully