Robust metal film encapsulation

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United States of America Patent

PATENT NO 8394522
APP PUB NO 20080261107A1
SERIAL NO

12111388

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to metal film encapsulation of an electrochemical device. The metal film encapsulation may provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure. The present invention may further include ways of providing heat and pressure resilience to the bonding layer and improving the robustness of the protection for the cell structure.

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Patent Owner(s)

  • SAPURAST RESEARCH LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bradow, Timothy N Littleton, US 5 159
Brantner, Paul C Conifer, US 14 326
Keating, Joseph A Broomfield, US 10 171
Narayan, Prativadi B Broomfield, US 7 118
Neudecker, Bernd J Littleton, US 43 1609
Snyder, Shawn W Golden, US 33 795

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