Composite woven fabric and printed wiring board
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United States of America Patent
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Mar 12, 2013
Grant Date -
Mar 18, 2010
app pub date -
Nov 7, 2007
filing date -
Nov 13, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is a printed wiring board which attains aims of printed wiring boards required for realizing high-speed, high-frequency semiconductor devices, namely a printed wiring board having low dielectric constant, low dielectric loss tangent and low linear expansion coefficient. Also disclosed is a composite woven fabric suitably used as a base material for such a printed wiring board. Specifically disclosed is a composite woven fabric containing quartz glass fibers and polyolefin fibers, in which the ratio of the quartz glass fibers to the composite woven fabric is set at 10 vol % or more and 90 vol % or less. It is preferred that the quartz glass fibers each have a filament diameter of 3 μm or more and 16 μm or less, and the composite woven fabric has a thickness of 200 μm or less.
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