Target utilization improvement for rotatable magnetrons
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United States of America Patent
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Mar 19, 2013
Grant Date -
Oct 6, 2011
app pub date -
Apr 2, 2010
filing date -
Apr 2, 2010
priority date (Note) -
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Abstract
Rotatable magnetron sputtering apparatuses are described for depositing material from a target while reducing premature burn through issues. The rotatable magnetron sputtering apparatus includes electric coils wound on pole pieces to modulate the magnetic fields at the ends of the magnetron magnetic assembly. Changing the direction of electric current moves the sputtering region alternately around its normal central position to decrease the rate of erosion depth at the ends of the target material.
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