Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages
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United States of America Patent
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Mar 19, 2013
Grant Date -
Feb 9, 2012
app pub date -
Oct 20, 2011
filing date -
Apr 24, 2008
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Abstract
Methods of forming pre-encapsulated frames comprise flowing a dielectric encapsulation material around at least one conductive trace. A cavity configured to receive at least one semiconductor device at least partially in the cavity is formed in the encapsulation material. A first connection area of the at least one trace is exposed within the cavity. At least another connection area of the at least one trace is exposed laterally adjacent to the cavity. The dielectric encapsulation material is hardened to form a pre-encapsulated frame.
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