Methods of dicing stacked shingled strip constructions to form stacked die packages
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 19, 2013
Grant Date -
N/A
app pub date -
Jul 9, 2009
filing date -
Jul 10, 2008
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of forming a bonded shingle stacked die package is provided. The method includes providing a wafer, singulating the wafer into a plurality of strips, applying to at least a portion of at least one mating surface of each of the plurality of strips a material capable of reacting with the other mating surface, stacking the plurality of strips in an overlapping stair-step configuration, exposing the stacked strips to conditions sufficient to bond the plurality of strips together, and dicing the stacked strips into individual die shingle stack configurations.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully