Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 19, 2013
Grant Date -
Apr 28, 2011
app pub date -
Jan 3, 2011
filing date -
Jan 17, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic component including an electronic element, an electrode that is formed on a first surface of the electronic element, a first resin layer that is formed over the first surface of the electronic element, a wiring that is electrically connected to the electrode, a first portion of the wiring extending over the first resin layer, a second resin layer that is formed over the first resin layer and the wiring, the second resin layer having an opening, the opening overlapping the first portion of the wiring, an external terminal that is provided above the second resin layer, the external terminal being connected to the first portion of the wiring via the opening, and a third resin layer that is formed over the second resin layer, the third resin layer being provided around the external terminal.
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