Method and apparatus for thermally conditioning probe cards
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United States of America Patent
Stats
-
Mar 19, 2013
Grant Date -
Dec 30, 2010
app pub date -
Jun 26, 2009
filing date -
Jun 26, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
Embodiments of probe cards and methods for fabricating and using same are provided herein. In some embodiments, an apparatus for testing a device (DUT) may include a probe card configured for testing a DUT; a thermal management apparatus disposed on the probe card to heat and/or cool the probe card; a sensor disposed on the probe card and coupled to the thermal management apparatus to provide data to the thermal management apparatus corresponding to a temperature of a location of the probe card; a first connector disposed on the probe card and coupled to the thermal management apparatus for connecting to a first power source internal to a tester; and a second connector, different than the first connector, disposed on the probe card and coupled to the thermal management apparatus for connecting to a second power source external to the tester.
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