RF rejecting lead
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United States of America Patent
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Mar 19, 2013
Grant Date -
Jul 12, 2012
app pub date -
Mar 21, 2012
filing date -
Nov 30, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A lead assembly for an implantable medical device includes a lead body having a first portion and a second portion. The first portion adapted for coupling to a pulse generator and the second portion is adapted for implantation. First and second conductive coils are positioned within the lead body and electrically isolated from each other. The first and second conductive coils each including a plurality of turns. Two or more adjacently wound consecutive turns of the first conductive coil alternate with two or more adjacently wound consecutive turns of the second conductive coil.
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