Method for producing an electric component-mounted substrate

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United States of America Patent

PATENT NO 8402645
SERIAL NO

12239356

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Abstract

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A method of producing an electric component-mounted substrate having a cavity structure is provided. Because a supporting substrate and electric components and are connected together to a first face of a base substrate, the number of steps for the connection is reduced to shorten the producing time. When electric components are to be connected to a second face, the base substrate is supported by the supporting substrate, and the electric components and connected to the first face do not contact a processing table and therefore they undergo no damage. Thus, an electric component-mounted substrate having high reliability can be produced in a short time.

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Patent Owner(s)

Patent OwnerAddress
SONY CHEMICAL & INFORMATION DEVICE CORPORATIONTOKYO 141-0032

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furuta, Kazutaka Tochigi, JP 23 181
Taniguchi, Masaki Tochigi, JP 29 120

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