Method of processing orifice

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United States of America Patent

PATENT NO 8402655
APP PUB NO 20100229385A1
SERIAL NO

12708261

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed herein is a method for processing an orifice capable of processing recessed portions and orifices, each having a unique hole diameter different from each other, to high positioning accuracy and in a short time.

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Patent Owner(s)

Patent OwnerAddress
HITACHI ASTEMO LTDHITACHINAKA-SHI IBARAKI 312-8503

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukushima, Hideki Hitachinaka, JP 16 54
Gunji, Kenichi Mito, JP 19 132
Higuma, Masato Hitachinaka, JP 14 74
Inoue, Tsuneyoshi Mito, JP 1 3
Tanaka, Yasuyuki Hitachinaka, JP 253 1824

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