Pre-planarization system and method
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United States of America Patent
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Mar 26, 2013
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app pub date -
Mar 31, 2004
filing date -
Mar 31, 2004
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Abstract
A method for producing a normalized surface on a substrate for a chemical mechanical planarization process is provided. The method initiates with grinding a surface of the substrate with a first surface associated with a first planarization length. The method includes planarizing the surface of the substrate with a second surface associated with a second planarization length. Here, the second planarization length being less than the first planarization length. A system for processing a semiconductor substrate is also provided.
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