Metal film encapsulation

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United States of America Patent

PATENT NO 8404376
APP PUB NO 20100203377A1
SERIAL NO

12764180

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Abstract

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The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.

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Patent Owner(s)

Patent OwnerAddress
SAPURAST RESEARCH LLC1209 ORANGE STREET CORPORATION TRUST CENTER WILMINGTON DE 19801

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brantner, Paul C Conifer, US 14 338
Neudecker, Bernd J Littleton, US 43 1662
Snyder, Shawn W Golden, US 36 810

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