Metal film encapsulation

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United States of America Patent

PATENT NO 8404376
APP PUB NO 20100203377A1
SERIAL NO

12764180

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Abstract

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The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.

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Patent Owner(s)

  • SAPURAST RESEARCH LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brantner, Paul C Conifer, US 14 326
Neudecker, Bernd J Littleton, US 43 1609
Snyder, Shawn W Golden, US 33 795

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