Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI)
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United States of America Patent
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Mar 26, 2013
Grant Date -
Nov 15, 2012
app pub date -
Jun 27, 2012
filing date -
Apr 24, 2006
priority date (Note) -
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Abstract
A method for fabricating a stacked semiconductor system with encapsulated through wire interconnects includes providing a substrate having a first side, a second side and a substrate contact; forming a via in the substrate contact and the substrate to the second side; placing a wire in the via; forming a first contact on the wire proximate to the first side and a second contact on the wire proximate to the second side; and forming a polymer layer on the first side leaving the first contact exposed. The method also includes stacking two or more substrates and electrically connecting the through wire interconnects on the substrates.
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