Methods of forming a gate structure

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United States of America Patent

PATENT NO 8404576
APP PUB NO 20110171818A1
SERIAL NO

13053923

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Abstract

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A gate structure includes an insulation layer on a substrate, a first conductive layer pattern on the insulation layer, a metal ohmic layer pattern on the first conductive layer pattern, a diffusion reduction layer pattern on the metal ohmic layer pattern an amorphous layer pattern on the diffusion reduction layer pattern, and a second conductive layer pattern on the amorphous layer pattern. The gate structure may have a low sheet resistance and desired thermal stability.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baek, Jong-Min Seoul, KR 31 542
Cha, Tae-Ho Gyeonggi-do, KR 20 155
Cheong, Seong-Hwee Seoul, KR 15 99
Choi, Gil-Heyun Seoul, KR 215 5305
Kim, Byung-Hee Seoul, KR 109 1759
Park, Hee-Sook Seoul, KR 76 557

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