Device and method for stopping an etching process
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United States of America Patent
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Mar 26, 2013
Grant Date -
May 14, 2009
app pub date -
Nov 9, 2007
filing date -
Nov 9, 2007
priority date (Note) -
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Abstract
A method for etching a layer assembly, the layer assembly including an intermediate layer sandwiched between an etch layer and a stop layer, the method including a step of etching the etch layer using a first etchant and a step of etching the intermediate layer using a second etchant. The first etchant includes a first etch selectivity of at least 5:1 with respect to the etch layer and the intermediate layer. The second etchant includes a second etch selectivity of at least 5:1 with respect to the intermediate layer and the stop layer. The first etchant being different from the second etchant.
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