Method for heat dissipation on semiconductor device
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United States of America Patent
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Mar 26, 2013
Grant Date -
Mar 2, 2006
app pub date -
Aug 31, 2004
filing date -
Aug 31, 2004
priority date (Note) -
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Abstract
A device and method wherein a thermo electric generator device is disposed between stacks of a multiple level device, or is provided on or under a die of a package and is conductively connected to the package. The thermo electric generator device is configured to generate a voltage by converting heat into electric power. The voltage which is generated by the thermo electric generator can be recycled back into the die itself, or to a higher-level unit in the system, even to a cooling fan.
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