Flexible circuit assembly without solder
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United States of America Patent
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Mar 26, 2013
Grant Date -
Aug 23, 2012
app pub date -
Apr 27, 2012
filing date -
May 8, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided is a flexible electronic assembly that uses no solder. Components or component packages are mounted on a flexible substrate. Vias connect through the substrate to the components' leads. Circuits are formed on the opposite side of the substrate interconnecting the component through the vias. The assembly is made flexible by removing encapsulent material between components.
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