Chips having rear contacts connected by through vias to front contacts
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United States of America Patent
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Mar 26, 2013
Grant Date -
Oct 9, 2008
app pub date -
Feb 26, 2008
filing date -
Mar 5, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plurality of first conductive contacts at the front surface connected to the device. A plurality of conductive vias may extend from the rear surface through the thin region of the semiconductor element to the first conductive contacts. A plurality of second conductive contacts can be exposed at an exterior of the semiconductor element. A plurality of conductive traces may connect the second conductive contacts to the conductive vias.
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