Method of assembling a circuit board assembly
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United States of America Patent
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Apr 2, 2013
Grant Date -
Nov 10, 2011
app pub date -
May 7, 2010
filing date -
May 7, 2010
priority date (Note) -
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Abstract
A method for manufacturing a silicon chip package for a circuit board assembly is provided with a package substrate having a silicon chip and an array of contact pads provided by conductive material. A plurality of conductive springs are affixed to the array of contact pads for providing conductive contact with the corresponding array of contacts on a circuit board assembly.
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