Printed circuit board with multiple metallic layers and method of manufacturing the same
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United States of America Patent
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Apr 2, 2013
Grant Date -
May 13, 2010
app pub date -
Jun 1, 2009
filing date -
Nov 13, 2008
priority date (Note) -
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Abstract
Provided is a printed circuit board (PCB) with multiple metallic layers and a method of manufacturing the PCB to improve adhesion between a metal film and a polymer film, on which a circuit pattern is formed. The PCB includes: a first metal film; a polymer film formed on one surface of the first metal film; and a second metal film, interposed between the first metal film and the polymer film, having a first surface facing the first metal film and a second surface facing the polymer film, wherein the second surface is rougher than the first surface.
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