Composition for formation of resist protection film, and method for formation of resist pattern using the same
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United States of America Patent
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Apr 2, 2013
Grant Date -
Feb 18, 2010
app pub date -
Sep 14, 2007
filing date -
Sep 20, 2006
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Abstract
Disclosed are: a composition for forming a resist protection film, which shows less damage to a resist film, can form a good, rectangular resist pattern, and can be used regardless of the structure of a resin used in a resist composition; and a method for forming a resist pattern by using the composition. Specifically, disclosed are: a composition for forming a resist protection film, which comprises (a) an alkali-soluble polymer and (b) an ether-based solvent; and a method for forming a resist pattern by using the composition.
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