Semiconductor device with chip mounted on a substrate
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United States of America Patent
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Apr 2, 2013
Grant Date -
Jul 3, 2008
app pub date -
Dec 28, 2007
filing date -
Dec 28, 2006
priority date (Note) -
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Abstract
A semiconductor device is disclosed. At least one semiconductor chip is mounted on a substrate and is contacted to contact elements of the substrate. The encapsulation of the semiconductor chip includes the substrate, a cover and a pocket within the connected substrate and cover. The pocket is able to fix the chip in its position, and the cover is composed of the same material as the substrate.
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