Methods for flattening a 3D surface into a 2D piece
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United States of America Patent
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Apr 2, 2013
Grant Date -
Mar 4, 2010
app pub date -
Aug 27, 2008
filing date -
Aug 27, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is a method for flattening a 3D surface into a 2D piece. In one embodiment, the method is implemented by constructing a plurality of wire-patches by feature curves on a surface patch of the 3D surface, wherein each of feature curves comprises a plurality of wire-nodes; computing an optimal 2D angle for each of said wire-nodes of the constructed wire-patches; determining an optimal position for each of said wire-nodes based on the computed optimal 2D angles thereof, respectively; and laying out each of said feature curves in 2D based on the determined optimal position. A device to flatten a 3D surface into a 2D piece is also provided.
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