Methods for flattening a 3D surface into a 2D piece

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United States of America Patent

PATENT NO 8411090
APP PUB NO 20100054625A1
SERIAL NO

12199551

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Abstract

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Disclosed is a method for flattening a 3D surface into a 2D piece. In one embodiment, the method is implemented by constructing a plurality of wire-patches by feature curves on a surface patch of the 3D surface, wherein each of feature curves comprises a plurality of wire-nodes; computing an optimal 2D angle for each of said wire-nodes of the constructed wire-patches; determining an optimal position for each of said wire-nodes based on the computed optimal 2D angles thereof, respectively; and laying out each of said feature curves in 2D based on the determined optimal position. A device to flatten a 3D surface into a 2D piece is also provided.

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Patent Owner(s)

Patent OwnerAddress
CHINESE UNIVERSITY OF HONG KONG THESHATIN NT HONG KONG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wang, Changling Charlie Hong Kong, CN 1 9

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