Enclosure for outside plant equipment with interconnect for mating printed circuit boards, printed circuit board device and method of repairing outside plant equipment
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Apr 2, 2013
Issued Date -
N/A
app pub date -
Nov 9, 2010
filing date -
Nov 9, 2010
priority date (Note) -
Withdrawn
status (Latency Note)
Importance
Abstract
An enclosure for outside plant equipment includes a base unit and first Printed Circuit Board (PCB) carried by the base unit and having a circuit side and opposing component side on which electronic components are mounted. A heat sink is connected to the first PCB at the circuit side and configured to dissipate heat from any electronic components mounted on the first PCB at the component side. A cover is attached to the base unit and has an inside surface covering the enclosure. A second PCB has a circuit side and opposing component side on which electronic components are mounted. The second PCB is supported by the inside surface of the cover. A heat sink is connected to the second circuit board at the circuit side and configured to dissipate heat from any electronic components mounted on the second PCB. A PCB finger connector interconnects the first and second PCB's at the component side.
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International Classification(s)
Cited Art Landscape
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