Microcontact printed thin film capacitors
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United States of America Patent
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Apr 9, 2013
Grant Date -
Jul 26, 2007
app pub date -
Oct 28, 2005
filing date -
Oct 28, 2005
priority date (Note) -
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Abstract
The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 μm or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.
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