Low thermal-impedance insulated metal substrate and method for manufacturing the same
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United States of America Patent
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Apr 9, 2013
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May 12, 2011
app pub date -
Nov 12, 2009
filing date -
Nov 12, 2009
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Abstract
A method for manufacturing a low thermal-impedance insulated metal substrate has steps of providing an electrical-conductive metal layer; forming a first thermal-conductive polymeric composite layer on the electrical-conductive metal layer; forming a second thermal-conductive polymeric composite layer on the first thermal-conductive polymeric composite layer; and adhere a thermal-conductive metal layer on the second thermal-conductive polymeric composite layer by hot-pressing process. Therefore, the low thermal-impedance insulated metal substrate of the present invention has lower thermal-impedance, lower coefficient of thermal expansion and higher electrical reliability.
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