Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulses
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United States of America Patent
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Apr 9, 2013
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N/A
app pub date -
Oct 16, 2009
filing date -
May 24, 2006
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Abstract
In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.
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