Optical semiconductor package sealing resin material
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United States of America Patent
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Apr 9, 2013
Grant Date -
Oct 28, 2010
app pub date -
Dec 8, 2008
filing date -
Dec 14, 2007
priority date (Note) -
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Abstract
An optical semiconductor package sealing resin material used to seal an optical semiconductor chip in a semiconductor package includes a thermosetting epoxy composition and a hydrophobic smectite clay mineral. The hydrophobic smectite clay mineral is hydrophobized by subjecting a hydrophilic smectite clay mineral to an intercalation reaction with an alkylammonium halide. The smectite clay mineral is bentonite, saponite, hectorite, vermiculite, stevensite, tainiolite, montmorillonite, or nontronite.
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