Materials and methods for stress reduction in semiconductor wafer passivation layers
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United States of America Patent
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Apr 9, 2013
Grant Date -
Mar 3, 2011
app pub date -
Sep 2, 2010
filing date -
Sep 3, 2009
priority date (Note) -
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Abstract
The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers.
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