Method of RTM molding

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8420002
APP PUB NO 20060125155A1
SERIAL NO

10530263

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of RTM molding wherein a reinforcing fiber substrate is placed in a mold, each of a first and a second resin distribution media exhibiting a resin flow resistance lower than the resistance of the reinforcing fiber substrate is placed on each surface of the reinforcing fiber substrate, and the inside of the mold is evacuated and a resin is injected into the mold to thereby impregnate the reinforcing fiber substrate with the resin injected, characterized in that the first resin distribution medium exhibits a resin flow resistance lower than that of the second resin distribution medium, and the evacuation is carried out through the second resin distribution medium while the resin is injected through the first resin distribution medium. The method can be advantageously employed for producing, in particular, FRP structure which is thick and excellent in designability, lightweight property and/or strength.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI HEAVY INDUSTRIES LTDJAPAN
TORAY INDUSTRIES INCTOKYO 103-8666

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kitaoka, Kazuaki Ehime, JP 4 36
Nishiyama, Shigeru Nagoya, JP 50 318
Odani, Hiroshi Ehime, JP 12 162
Sekido, Toshihide Otsu, JP 19 259
Shimizu, Masahiko Nagoya, JP 167 1308

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