Hair or skin conditioning compositions comprising hydrophobically modified amido silicone copolyol
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United States of America Patent
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Apr 16, 2013
Grant Date -
Aug 31, 2006
app pub date -
Feb 27, 2006
filing date -
Feb 25, 2005
priority date (Note) -
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Abstract
Disclosed are hair or skin conditioning compositions comprising by weight: (a) from about 0.1% to about 10% of a thickening polymer system; (b) from about 0.1% to about 8.0% of a surfactant system selected from the group consisting of cationic surfactant, nonionic surfactant, and mixtures thereof; (c) from about 0.1% to about 10% of a hydrophobically modified amido silicone copolyol; and (d) an aqueous carrier; wherein the composition has a transmittance of 25% or more and/or wherein the composition has a viscosity of from about 1,000 cps to about 50,000 cps and Shear Thinning Index of 30 or more. The compositions are especially suitable for hair care products such as hair conditioning products for rinse-off/leave-on use.
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