Semiconductor device and method for manufacturing a semiconductor device
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United States of America Patent
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Apr 16, 2013
Grant Date -
Apr 16, 2009
app pub date -
Oct 10, 2007
filing date -
Oct 10, 2007
priority date (Note) -
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Abstract
A semiconductor device mountable to a substrate is provided. The device includes a semiconductor package having at least one semiconductor die, an electrically conductive attachment region, and a packaging material in which is embedded the semiconductor die and a first portion of the electrically conductive attachment region contacting the die. A metallic shell encloses the embedded semiconductor die and the first portion of the electrically conductive attachment region.
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