Semiconductor device having metal lines with slits
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United States of America Patent
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Apr 16, 2013
Grant Date -
Mar 24, 2011
app pub date -
Dec 1, 2010
filing date -
Feb 20, 2001
priority date (Note) -
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Abstract
A semiconductor device including a semiconductor substrate, an integrated circuit on the semiconductor substrate, an insulation layer covering the integrated circuit, and a plurality of metal line patterns on the insulation layer. First and second adjacent metal line patterns of the plurality of metal line patterns are spaced apart from each other by a space, and each of the first and second adjacent metal line patterns has at least one slit.
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