Solder in cavity interconnection technology
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United States of America Patent
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Apr 23, 2013
Issued Date -
N/A
app pub date -
Dec 21, 2009
filing date -
Dec 21, 2009
priority date (Note) -
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Abstract
An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.
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