Low profile semiconductor device socket
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 23, 2013
Grant Date -
N/A
app pub date -
Dec 1, 2011
filing date -
Dec 1, 2011
priority date (Note) -
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status (Latency Note)
Importance
Abstract
Various circuit board sockets and methods of manufacturing and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a socket operable to receive a first circuit board. The socket includes a housing and a cover slidedly coupled to the housing. The cover has an opening sized to enable the first circuit board to seat on the housing.
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