Bonding apparatus, method for preventing dissolving of adhesive agent, and bonding method

United States of America Patent

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Apr 23, 2013
Grant Date
Apr 22, 2010
app pub date
Apr 11, 2008
filing date
May 30, 2007

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Expired

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Abstract

A bonding unit (20) bonding a wafer (12) and a support plate (14) with a mediation of an adhesive agent (16) to form a bonded substance (18), and a plasma treatment unit (22) treating the bonded substance (18) with a plasma treatment are provided.

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Patent Owner(s)

Patent Owner	Address
TOKYO OHKA KOGYO CO LTD	150 NAKAMARUKO NAKAHARA-KU KAWASAKI-SHI KANAGAWA 2110012 ?2110012

International Classification(s)

B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

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Inventor Name	Address	# of filed Patents	Total Citations
Miyanari, Atsushi	Kawasaki, JP	33	429
Ohya, Satoshi	Kawasaki, JP	21	296

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Bonding apparatus, method for preventing dissolving of adhesive agent, and bonding method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

12451629

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PATENT NO	8425713
APP PUB NO	20100096080A1
SERIAL NO	12451629
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 23, 2013	US,8425713,B2 US8425713B2	GRANTED PATENT AS SECOND PUBLICATION
April 22, 2010	US,20100096080,A1 US20100096080A1	FIRST PUBLISHED PATENT APPLICATION

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12451629

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