Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
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United States of America Patent
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Apr 23, 2013
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app pub date -
Mar 31, 2008
filing date -
Mar 31, 2008
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Abstract
In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
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