Methods of patterning a conductor on a substrate
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United States of America Patent
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Apr 23, 2013
Grant Date -
Sep 3, 2009
app pub date -
Feb 26, 2009
filing date -
Feb 28, 2008
priority date (Note) -
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Abstract
A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form an electrically conductive micropattern corresponding to the raised features of the inked stamp on the visible light transparent substrate.
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