Positive resist composition for use with electron beam, X-ray or EUV and pattern forming method using the same
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United States of America Patent
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Apr 23, 2013
Grant Date -
Aug 13, 2009
app pub date -
Feb 12, 2009
filing date -
Feb 13, 2008
priority date (Note) -
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Abstract
A positive resist composition for use with electron beam, X-ray or EUV and a pattern forming method using the positive resist composition are provided, the positive resist composition including: (A) a resin capable of decomposing under an action of an acid to increase a dissolution rate in an aqueous alkali solution; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a basic compound; and (D) an organic solvent, wherein the entire solid content concentration in the resist composition is from 1.0 to 4.5 mass % and a ratio of (B) the compound capable of generating an acid upon irradiation with actinic rays or radiation is from 10 to 50 mass % based on the entire solid content.
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