Positive-type photosensitive composition
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United States of America Patent
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Apr 23, 2013
Grant Date -
Mar 17, 2011
app pub date -
May 13, 2009
filing date -
May 14, 2008
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Abstract
Disclosed is a positive-type photosensitive composition which can form a metal compound film pattern at high resolution and with less affection by organic residues. The positive-type photosensitive composition comprises: a metal complex component (A) which can form a metal compound film when applied and subsequently fired; and a photosensitizing agent (B). In the composition, a ligand in the component (A) is preferably a multidentate ligand having an aromatic compound as its skeleton. According to this construction, even a composition containing substantially no photosensitive resin can impart photosensitivity and a metal compound film pattern can be formed readily.
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