Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same

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United States of America Patent

PATENT NO 8426109
APP PUB NO 20120015293A1
SERIAL NO

13228135

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Abstract

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A positive type resist composition for use in liquid immersion exposure comprises: (A) a resin having a monocyclic or polycyclic cycloaliphatic hydrocarbon structure, the resin increasing its solubility in an alkali developer by an action of acid; (B) a compound generating acid upon irradiation with one of an actinic ray and a radiation; (C) an alkali soluble compound having an alkyl group of 5 or more carbon atoms; and (D) a solvent.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATION26-30 NISHIAZABU 2-CHOME MINATO-KU TOKYO 1068620 JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inabe, Haruki Shizuoka, JP 42 1026
Kanda, Hiromi Shizuoka, JP 50 897

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