L-shaped feature, method of making an L-shaped feature and method of making an L-shaped structure

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United States of America Patent

PATENT NO 8426114
APP PUB NO 20120196209A1
SERIAL NO

13016841

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Abstract

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In accordance with an embodiment of the present invention, a method for making a semiconductor device comprises forming a photo sensitive layer on a semiconductive substrate, and forming an L-shaped structure in the photo sensitive layer by exposing the photo sensitive layer to light via a reticle, wherein the reticle comprises an L-shapes feature having a first non-orthogonal edge at an intersection of two legs of the L-shaped feature.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGGERMAN BERG LAURA IBIZA NAUMBURG SAXONY-ANHALT

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haffner, Henning Pawling, US 48 810
Ostermayr, Martin Beacon, US 38 168

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