Semiconductor device
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United States of America Patent
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Apr 23, 2013
Grant Date -
Jul 7, 2011
app pub date -
Jan 7, 2010
filing date -
Jan 7, 2010
priority date (Note) -
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Abstract
A method of manufacturing a semiconductor device includes providing a carrier and attaching a plurality of semiconductor chips to the carrier. The semiconductor chips have a first electrode pad on a first main face and at least a second electrode pad on a second main face opposite to the first main face, whereby the first electrode pad is electrically connected to the carrier. A plurality of first bumps are formed on the carrier, the first bumps being made of a conductive material. The carrier is then singulated into a plurality of semiconductor devices, wherein each semiconductor device includes at least one semiconductor chip and one first bump.
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