Method of manufacturing semiconductor device, solid-state imaging device, and solid-state imaging apparatus

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United States of America Patent

PATENT NO 8426287
APP PUB NO 20110127592A1
SERIAL NO

12945255

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Abstract

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A method of manufacturing a semiconductor device includes the steps of forming a gate electrode of a transistor on an insulator layer on a surface of a semiconductor substrate, forming an isolation region by performing ion implantation of an impurity of a first conductivity type into the semiconductor substrate, forming a lightly doped drain region by performing, after forming a mask pattern including an opening portion narrower than a width of the gate electrode on an upper layer of the gate electrode of the transistor, ion implantation of an impurity of a second conductivity type near the surface of the semiconductor substrate with the mask pattern as a mask, and forming a source region and a drain region of the transistor by performing ion implantation of an impurity of the second conductivity type into the semiconductor substrate after forming the gate electrode of the transistor.

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Patent Owner(s)

Patent OwnerAddress
SONY SEMICONDUCTOR SOLUTIONS CORPORATION4-14-1 ASAHI-CHO ATSUGI-SHI KANAGAWA 2430014 ?2430014

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yanagita, Masashi Kumamoto, JP 11 22

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